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74F256 데이터 시트보기 (PDF) - Philips Electronics

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74F256
Philips
Philips Electronics Philips
74F256 Datasheet PDF : 12 Pages
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Philips Semiconductors
Dual addressable latch
Product specification
74F256
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL
PARAMETER
VCC Supply voltage
VIN
Input voltage
IIN
Input current
VOUT Voltage applied to output in High output state
IOUT Current applied to output in Low output state
Tamb Operating free-air temperature range
Tstg
Storage temperature range
RATING
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
–0.5 to VCC
40
0 to +70
–65 to +150
UNIT
V
V
mA
V
mA
°C
°C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
VIH
VIL
IIK
IOH
IOL
Tamb
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free-air temperature range
LIMITS
UNIT
MIN
NOM
MAX
4.5
5.0
5.5
V
2.0
V
0.8
V
–18
mA
–1
mA
20
mA
0
70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
CONDITIONS1
LIMITS
UNIT
MIN TYP2 MAX
VOH
High-level output voltage
VOL
Low-level output voltage
VIK
Input clamp voltage
II
Input current at maximum input voltage
IIH
High-level input current
IIL
Low-level input current
IOS
Short-circuit output current3
VCC = MIN, VIL = MAX,
VIH = MIN, IOL = MAX
VCC = MIN, VIL = MAX,
VIH = MIN, IOL = MAX
VCC = MIN, II = IIK
VCC = MAX, VI = 7.0V
VCC = MAX, VI = 2.7V
VCC = MAX, VI = 0.5V
VCC = MAX
±10%VCC 2.5
V
±5%VCC 2.7 3.4
V
±10%VCC
0.35 0.50 V
±5%VCC
0.35 0.50 V
–0.73 -1.2 V
100 µA
20 µA
–0.6 mA
–60
–150 mA
ICC
Supply current (total)
ICCH VCC = MAX
21 42 mA
ICCL
33 60 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. To reduce the effect of external noise during test.
4. Not more than one output should be shorted at a time. For testing IOS, the use of High-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
1988 Nov 29
5

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