L4995 데이터 시트보기 (PDF) - STMicroelectronics
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L4995 Datasheet PDF : 35 Pages
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Package and PCB thermal data
4
Package and PCB thermal data
4.1
PowerSSO-12 thermal data
Figure 31. PowerSSO-12 PC board(1)
L4995
("1($'5
1. Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x
86mm,PCB thickness=1.6mm, Cu thickness=70μm (front and back side) Thermal vias separation 1.2 mm,
Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x
6.5 mm).
Figure 32. Rthj-amb vs PCB copper area in open box free air condition
RTHj _amb( ° C/ W)
70
65
60
55
50
45
40
0
2
4
6
PCB Cu heat sink area ( cm^ 2)
8
10
GAPGMS00082
20/35
Doc ID 13103 Rev 13
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