L6258E(2004) 데이터 시트보기 (PDF) - STMicroelectronics
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L6258E Datasheet PDF : 24 Pages
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L6258E
Figure 4. Thermal Characteristics
Conditions
Power Dissipated T Ambient Thermal J-A resistance
(W)
(˚C)
(˚C/W)
pad layout + ground layers + 16 via hol
PCB ref.: 4 LAYER cm 12 x 12
5.3
70
15
pad layout + ground layers
PCB ref.: 4 LAYER cm 12 x 12
4.0
70
20
pad layout + 6cm2 on board heat sink
PCB ref.: 2 LAYER cm 12 x 12
2.3
70
35
D02IN1370
12
10
8
6
4
2
0
0
15˚C/W
20˚C/W
35˚C/W
20
40
60
80
100
120
140
160
Ambient Temperature (˚C)
D02IN1371
4/24
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