DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

L9942XP1 데이터 시트보기 (PDF) - STMicroelectronics

부품명
상세내역
제조사
L9942XP1 Datasheet PDF : 40 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Device description
L9942
2.5
Temperature warning and thermal shutdown
If junction temperature rises above Tj TW a temperature warning flag is set which is
detectable via the SPI. If junction temperature increases above the second threshold Tj SD,
the thermal shutdown bit will be set and power DMOS transistors of all output stages are
switched off to protect the device. In order to reactivate the output stages the junction
temperature must decrease below Tj SD -Tj SD HYS and the thermal shutdown bit has to be
cleared by the microcontroller.
2.6
Inductive loads
Each half bridge is built by an internally connected highside and a low-side power DMOS
transistor. Due to the built-in reverse diodes of the output transistors, inductive loads can be
driven without external free-wheeling diodes. In order to reduce the power dissipation during
free-wheeling condition the PWM controller will switch-on the output transistor parallel to the
freewheeling diode (synchronous rectification).
2.7
Cross-current protection
The four half-brides of the device are cross-current protected by an internal delay time
depending on the programmed slew rate. If one driver (LS or HS) is turned-off then
activation of the other driver of the same half bridge will be automatically delayed by the
cross-current protection time.
2.8
PWM current regulation
An internal current monitor output of each high-side and low-side transistor sources a
current image which has a fixed ratio of the instantaneous load current. This current images
are compared with the current limit in PWM control. Range of limit can reach from
programmed full scale value (register1 DAC Scale) down belonging LSB value of 5 bit DAC
(register1 DAC Phase x). The data of the two 5 bit DACs comes form set up in 9 current
profiles (register2 to 6). If signal changes to logic high at pin STEP then 2 current profiles
are moved in register1 for DAC Phase A and B. Number of profile depends on phase
counter reading and direction bit in register0 (Figure 7). The bridges are switched on until
the load current sensed at HS switch exceeds the limit. Load current comparator signal is
used to detect open load or overcurrent condition also.
2.9
Decay modes
During off-time the device will use one of several decay modes programmable by SPI
(Figure 4 top). In slow decay mode HS switches are activated after cross current protection
time for synchronous rectification to reduce the power dissipation (Figure 4 detail A). In fast
decay opposite half bridge will switched on after cross current protection time, that is same
like change in the direction. For mixed decay the duration of fast decay period before slow
decay can be set to a fixed time (Figure 4 detail B continuous line) or is triggered by under-
run of the load current limit (Figure 4 detail B dashed line), that can be detected at LS
switch. The special mode where the actual phase counter value is taken into account to
select the decay mode is called auto decay (e.g. in Figure 3 Micro Stepping DIR=1). If the
absolute value of the current limit is higher as during step before then PWM control uses
10/40
Doc ID 11778 Rev 7

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]