MAS9164 데이터 시트보기 (PDF) - Micro Analog Systems Oy
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MAS9164 Datasheet PDF : 10 Pages
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SOLDERING INFORMATION
x For Eutectic Sn/Pb TSOT-5
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
x For Lead-free TSOT-5
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
TAPE & REEL SPECIFICATIONS
A
D
B
DA9164.006
14 March 2003
According to RSH test IEC 68-2-58/20 2*220°C
235°C
3
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
According to RSH test IEC 68-2-58/20
260 °C
3
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
W3
W2
8 mm
C
N
W1
Feeding Direction
4 mm
Other Dimensions according to EIA-481 Standard
3000 Components on Each Reel
Dimension
A
B
C
D
N
W1 (measured at hub)
W2 (measured at hub)
W3 (includes flange distortion at outer edge)
Trailer
Leader
Min
1.5
12.80
20.2
50
8.4
7.9
160
390,
of which minimum 160 mm of
empty carrier tape sealed with
cover tape
Max
178
13.50
9.9
14.4
10.9
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
9 (10)
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