LPC2364 데이터 시트보기 (PDF) - NXP Semiconductors.

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LPC2364

Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC

NXP Semiconductors. 

NXP Semiconductors

LPC2364/65/66/67/68

Single-chip 16-bit/32-bit microcontrollers

 On-chip PLL allows CPU operation up to the maximum CPU rate without the need for

a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,

or the RTC oscillator.

 Boundary scan for simplified board testing is available in LPC2364FET100 and

LPC2368FET100 (TFBGA package).

 Versatile pin function selections allow more possibilities for using on-chip peripheral

functions.

3. Applications

 Industrial control

 Medical systems

 Protocol converter

 Communications

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

Version

LPC2364FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2364HBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2364FET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC2365FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2366FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2367FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2368FBD100 LQFP100 plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm SOT407-1

LPC2368FET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC2364_65_66_67_68

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 7.1 — 16 October 2013

© NXP B.V. 2013. All rights reserved.

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