LT1310 데이터 시트보기 (PDF) - Linear Technology

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LT1310

1.5A Boost DC/DC Converter with Phase-Locked Loop

Linear Technology 

LT1310

APPLICATIO S I FOR ATIO

Layout Hints

The high speed operation of the LT1310 demands careful

attention to board layout. You will not get advertised

performance with careless layout. Figure 6 shows the

recommended component placement for a boost

converter.

CC RC

R1

R2 CT

VIN

CIN

SHDN

LT1310

L1

SYNC

RLP

CLP

COUT

SW

MULTIPLE VIAS

D1

GND

VOUT

1310 F06

Figure 6. Recommended Component Placement for Boost Converter. Note Direct High Current Paths Using Wide PC Traces. Minimize

Trace Area at Pin 10 (VC), Pin 9 (CT) and Pin 1 (FB). Use Multiple Vias to Tie Pin 5 Copper and the Exposed Pad to Ground Plane. Use

Vias at One Location Only to Avoid Introducing Switching Currents Into the Ground Plane

PACKAGE DESCRIPTIO

MSE Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1663)

0.254

(.010)

GAUGE PLANE

DETAIL “A”

0° – 6° TYP

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

10 9 8 7 6

0.497 ± 0.076

(.0196 ± .003)

REF

4.90 ± 0.15

(1.93 ± .006)

3.00 ± 0.102

(.118 ± .004)

NOTE 4

12345

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.06 ± 0.102

1

(.081 ± .004)

1.83 ± 0.102

(.072 ± .004)

10

0.53 ± 0.01

(.021 ± .006)

DETAIL “A”

1.10

(.043)

MAX

0.18

(.007)

SEATING

PLANE 0.17 – 0.27

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.007 – .011)

TYP

0.50

(.0197)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

2.794 ± 0.102

(.110 ± .004)

0.889 ± 0.127

(.035 ± .005)

0.13 ± 0.076

(.005 ± .003)

5.23

(.206)

MIN

2.083 ± 0.102 3.2 – 3.45

(.082 ± .004) (.126 – .136)

MSOP (MSE) 0802

0.305 ± 0.038

(.0120 ± .0015)

TYP

0.50

(.0197)

BSC

RECOMMENDED SOLDER PAD LAYOUT

sn1310 1310fs

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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