LTC3528B-2 데이터 시트보기 (PDF) - Linear Technology

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LTC3528B-2

1A, 2MHz Synchronous Step-Up DC/DC Converter in 2mm × 3mm DFN

Linear Technology 

LTC3528B-2

ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the specified operating

junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 1.2V, VOUT = 3.3V, unless otherwise noted.

PARAMETER

CONDITIONS

MIN TYP MAX UNITS

SHDN Input High Voltage

0.88

V

SHDN Input Low Voltage

0.25

V

SHDN Input Current

PGOOD Threshold Percentage

VSHDN = 1.2V

Referenced to Feedback Voltage Falling

0.3

1

µA

–7

–10

–13

%

PGOOD Low Voltage

PGOOD Leakage Current

IPGOOD = 1mA

VOUT = 1.6V, IPGOOD = 1mA

VPGOOD = 5.5V

0.05

0.1

V

0.05

0.2

V

0.01

1

µA

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3528B-2 is tested under pulsed load conditions such that

TJ ≈ TA. The LTC3528BE-2 is guaranteed to meet specifications from

0°C to 85°C junction temperature. Specifications over –40°C to

125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. Note that

the maximum ambient temperature consistent with these specifications

is determined by specific operating conditions in conjunction with board

layout, the rated package thermal impedance and other environmental

factors. The junction temperature (TJ, in °C) is calculated from the ambient

temperature (TA, in °C) and power dissipation (PD, in Watts) according to

the formula:

TJ = TA + (PD • qJA)

where qJA = 76°C/W is the package thermal impedance.

Note 3: Specification is guaranteed by design and not 100% tested in

production.

Note 4: Current measurements are made when the output is not switching.

Note 5: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction

temperature may result in device degradation or failure.

Note 6: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal resistance much higher than

76°C/W.

Note 7: The IC is tested in a feedback loop to make the measurement.

3528b2fa

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