TC1054-3.3VCT 데이터 시트보기 (PDF) - Microchip Technology
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TC1054-3.3VCT Datasheet PDF : 18 Pages
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TC1054/TC1055/TC1186
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ....................................................................6.5V
Output Voltage .....................................(-0.3V) to (VIN + 0.3V)
Power Dissipation ......................... Internally Limited (Note 6)
Maximum Voltage on Any Pin ...................VIN +0.3V to -0.3V
Operating Junction Temperature Range .. -40°C < TJ < 125°C
Storage Temperature.....................................-65°C to +150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VOUT + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
Maximum Output Current
VIN
2.7
—
6.0
V Note 8
IOUTMAX
50
—
100
—
—
mA TC1054
—
TC1055
150
—
—
TC1186
Output Voltage
VOUT Temperature Coefficient
VOUT
TCVOUT
VR – 2.5% VR ±0.5% VR + 2.5% V Note 1
—
20
—
ppm/°C Note 2
—
40
—
Line Regulation
ΔVOUT/ΔVIN
—
Load Regulation:
ΔVOUT/VOUT
TC1054; TC1055
—
TC1186
—
Dropout Voltage:
VIN-VOUT
—
—
—
TC1055; TC1186
—
TC1186
—
Supply Current
Shutdown Supply Current
Power Supply Rejection Ratio
IIN
—
IINSD
—
PSRR
—
0.05
0.5
0.5
2
65
85
180
270
50
0.05
64
0.35
2
3
—
—
120
250
400
80
0.5
—
% (VR + 1V) ≤ VIN ≤ 6V
(Note 3)
% IL = 0.1 mA to IOUTMAX
IL = 0.1 mA to IOUTMAX
mV IL = 100 µA
IL = 20 mA
IL = 50 mA
IL = 100 mA
IL = 150 mA (Note 4)
µA SHDN = VIH, IL = 0 µA (Note 9)
µA SHDN = 0V
dB f ≤ 1 kHz
Output Short Circuit Current
Thermal Regulation
Thermal Shutdown Die
Temperature
IOUTSC
—
ΔVOUT/ΔPD
—
TSD
—
300
0.04
160
450
mA VOUT = 0V
—
V/W Notes 5, 6
—
°C
Thermal Shutdown Hysteresis
ΔTSD
—
10
—
°C
Note 1: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
2: TC VOUT = (VOUTMAX – VOUTMIN)x 106
VOUT x ΔT
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations”, “Ther-
mal Considerations”, for more details.
7: Hysteresis voltage is referenced by VR.
8: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
9: Apply for junction temperatures of -40C to +85C.
DS21350D-page 2
© 2007 Microchip Technology Inc.
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