LX1004(2005) 데이터 시트보기 (PDF) - Microsemi Corporation

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LX1004
(Rev.:2005)

1.2V & 2.5V MICROPOWER VOLTAGE REFERENCES

Microsemi Corporation 

LX1004

PRODUCT DATABOOK 1996/1997

1.2V & 2.5V MICROPOWER VOLTAGE REFERENCES

PRODUCTION DATA SHEET

A B S O L U T E M A X I M U M R AT I N G S (Note 1)

Reverse Breakdown Current .................................................................................... 30mA

Forward Current ........................................................................................................ 10mA

Operating Temperature Range ....................................................................... 0°C to 70°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (soldering, 10 seconds) ............................................................. 300°C

Pb-free / RoHS Peak Package Solder Reflow Temp (40 second max. exposure) .............. 260°C (+0, -5)

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal

PACKAGE PIN OUTS

N/C 1.

N/C 2.

N/C 3 .

ANODE 4.

8. CATHODE

7. N/C

6. CATHODE

5. N/C

DM PACKAGE

(Top View)

100% Pb-free / RoHS Matte Tin Lead Finish

T H E R M A L D ATA

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

LP PACKAGE:

165ºC/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

165ºC/W

The θJA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow.

1. ANODE

2. CATHODE

3. N/C

LP PACKAGE

(Top View)

2

Copyright © 1996

Rev. 1.2a 8/04

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