LX5516 데이터 시트보기 (PDF) - Microsemi Corporation
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LX5516 Datasheet PDF : 3 Pages
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LX5516
® InGaP HBT 2.4 - 2.5 GHz Power Amplifier Module
TM
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ..............................................................................5V
Collector Current...................................................................................... 500mA
Total Power Dissipation .................................................................................2W
RF Input Power (With 50 Ohm Load at Output) ...................................... +10 dBm
Maximum operating Junction Temperature (Tj)……………………………… …..
150°C
Operation Ambient Temperature ..................................................... -40 to +85°C
Storage Temperature.....................................................................-60 to +150°C
Package Peak Temp. for Solder Reflow (40 seconds maximum exposure)260°C (+0
-5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified terminal.
PACKAGE PIN OUT
VC1
RF
Output
RF Input
DET VB VCC
LL PACKAGE
(Bottom View)
RoHS / Pb-free 100% NiPdAu Lead
Finish
THERMAL DATA
LL Plastic MLPQ 12-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
7.9 C/W
76.5 C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient airflow.
Name
RF IN (2)
VCC (4)
VB (5)
DET(6)
RF OUT(8)
VC1(11)
GND
(1,3,7,9,10,
12)
FUNCTIONAL PIN DESCRIPTION
Description
RF input for the power amplifier.
Supply voltage for the bias reference and control circuits.
Bias control voltage for the first and second stage.
Output power Detector.
RF output and power supply for the second stage amplifier.
DC supply voltage for the first stage amplifier.
The center metal base of the MLP package provides both DC/RF ground as well as heat sink for the power
amplifier.
PINs to be grounded to the center metal on the PCB.
Copyright © 2008
Rev 1.0, 2008-12-16
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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