M63028/029FP
Thermal Derating
6.0
(W)
5.0
4.0
3.0
2.0
1.0
using N-type board
using P-type board
0
25
50
75
100
125 150
Ambient Temperature Ta (˚C)
This IC's package is POWER-SSOP, so improving the board on which the IC is mounted enables a large power
dissipation without a heat sink.
For example, using an 1 layer glass epoxy resin board, the IC's power dissipation is 2.6W at least. And it comes to
3.6W by using an improved 2 layer board.
The information of the N, P type board is shown in attached.
Rev.1.0, Sep.16.2003, page 5 of 21