MAAP-008509-MCH000 데이터 시트보기 (PDF) - Tyco Electronics
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MAAP-008509-MCH000 Datasheet PDF : 5 Pages
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Amplifier, Power, 10W
8.5—10.5 GHz
Assembly and Bonding Diagram
0.1 μF
0.1 μF
VDD
VGG
0.1μF
100 pF
100 pF
100 pF
MA08509D
Rev A
Preliminary Information
RFIN
RFOUT
VGG
0.1μF
100 pF
100 pF
0.1 μF
100 pF
0.1 μF
VDD
Figure 5. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW testing.
NOTE: Indicated Gate voltage pad (VGG 2) represents the nominal bias
condition. However, the device current can be increased or decreased
as required by bonding to either VGG 1 or VGG 3 (respectively).
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less
than 7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to
VDD to prevent damage to amplifier.
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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