SOLDERING INFORMATION (QFN-6)
DA9285.004
13 July 2006
N For Lead-Free / RoHS Compliant Green QFN 2mm x 2mm x 0.75mm
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in IPC/JEDEC J-STD-020
should not be exceeded. http://www.jedec.org
7.62 - 25.4 µm, Matte Tin
EMBOSSED TAPE SPECIFICATIONS (QFN-6)
PO
P2
DO
P1
X
W
T
E
F
10 O MAX
B0
X
A0
User Direction of Feed
K0
Detail X-X
Dimension
Min/Max
Unit
Ao
2.30 ±0.05
mm
Bo
2.30 ±0.05
mm
Do
1.50 +0.1/-0.0
mm
E
1.75 ±0.10
mm
F
3.50 ±0.05
mm
Ko
1.00 ±0.05
mm
Po
4.0
mm
P1
4.0 ±0.10
mm
P2
2.0 ±0.05
mm
T
0.254 ±0.02
mm
W
8.00 ±0.3/-0.1
mm
9 (11)