MAX3266(1999) 데이터 시트보기 (PDF) - Maxim Integrated

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MAX3266
(Rev.:1999)

1.25Gbps/2.5Gbps, +3V to +5.5V, Low-Noise Transimpedance Preamplifiers for LANs

Maxim Integrated 

1.25Gbps/2.5Gbps, 3V to 5.5V, Low-Noise

Transimpedance Preamplifiers for LANs

ABSOLUTE MAXIMUM RATINGS

Supply Voltage (VCC - GND) .................................-0.5V to +6.0V

IN Current..............................................................-4mA to +4mA

FILTER Current......................................................-8mA to +8mA

Voltage at OUT+, OUT- ...................(VCC - 1.5V) to (VCC + 0.5V)

Continuous Power Dissipation (TA = +70°C)

SO package (derate 6.7mW/°C above +70°C).............533mW

Storage Temperature Range .............................-55°C to +150°C

Operating Junction Temperature (die) ..............-55°C to +150°C

Processing Temperature (die) .........................................+400°C

Lead Temperature (soldering, 10sec) .............................+300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VCC = +3.0V to +5.5V, TA = 0°C to +70°C, 100Ω load between OUT+ and OUT-. Typical values are at TA = +25°C, VCC = 3.3V,

source capacitance = 0.85pF, unless otherwise noted.) (Note 1)

PARAMETER

CONDITIONS

MIN TYP MAX UNITS

Input Bias Voltage

0.69 0.83 0.91

V

Supply Current

26

50

mA

Transimpedance

Differential, measured

with 30µAp-p signal

(40µAp-p for MAX3267)

MAX3266

MAX3267

2260 2800 3400

Ω

1540 1900 2330

Output Impedance

Maximum Differential Output

Voltage

Filter Resistor

AC Input Overload

DC Input Overload

Single-ended (per side)

Input = 1mAp-p

48

185

1220

1.0

0.65

50

250

1500

52

415

1860

Ω

mVp-p

Ω

mAp-p

mA

Input-Referred RMS Noise

Input-Referred Noise Density

Small-Signal Bandwidth

Low-Frequency Cutoff

Transimpedance Linear Range

Deterministic Jitter

Power-Supply Rejection Ratio

(PSRR)

Die, packaged in TO-56

header (Note 2)

MAX3266

SO package

(Note 2)

(Note 2)

MAX3266

MAX3266

MAX3267

MAX3266

MAX3267

MAX3267

-3dB, input ≤ 20µADC

Peak-to-peak

0.95 < linearity < 1.05

(Note 3)

MAX3266

MAX3267

MAX3266

MAX3267

Output referred, f < 2MHz

PSRR = -20log (∆VOUT/∆VCC)

750

1530

30

40

192

200

485

6.6

11.0

920

1900

44

19

12

50

256

nA

655

pA/(Hz)1/2

1100

2420

MHz

kHz

µAp-p

76

ps

ps

50

dB

Note 1: Source Capacitance represents the total capacitance at the IN pin during characterization of noise and bandwidth parame-

ters. Figure 1 shows the typical source capacitance vs. reverse voltage for the photodiode used during characterization of

TO-56 header packages. Noise and bandwidth will be affected by the source capacitance. See the Typical Operating

Characteristics for more information.

Note 2: Input-Referred Noise is calculated as RMS Output Noise / (Gain at f = 10MHz). Noise Density is (Input-Referred Noise) /

√bandwidth. No external filters are used for the noise measurements.

Note 3: Deterministic Jitter is measured with the K28.5 pattern applied to the input [00111110101100000101].

2 _______________________________________________________________________________________

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