TDA2009 데이터 시트보기 (PDF) - STMicroelectronics
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TDA2009 Datasheet PDF : 12 Pages
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TDA2009A
Figure 17 : P.C. BOARD and Components Layout of the Circuit of Figure 16 (1:1 scale)
APPLICATION SUGGESTION
The recommended values of the components are those shown on application circuit of fig. 1. Different
values can be used ; the following table can help the designer.
Component
R1, R3
R2, R4
R5, R6
C1, C2
Recommended
Value
1.2kΩ
18kΩ
1Ω
2.2µF
Purpose
Close Loop Gain
Setting (1)
Frequency Stability
Input DC Decoupling
Larger than
Increase of Gain
Decrease of Gain
Danger of Oscillation at High
Frequency with Inductive Load
High Turn-on Delay
C3
C6, C7
C8, C9
C10, C11
22µF
220µF
0.1µF
1000µF to
2200µF
Ripple Rejection
Feedback Input DC
Decoupling
Frenquency Stability
Output DC
Decoupling
Better SVR. Increase of the
Switch-on Time
Smaller than
Decrease of Gain
Increase of Gain
High Turn-on Pop.
Higher Low Frequency
Cut-off. Increase of Noise
Degradation of SVR
Danger of Oscillation
Higher Low-frequency
Cut-off
(1) The closed loop gain must be higher than 26dB.
BUILD-IN PROTECTION SYSTEMS
THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers the
following advantages:
1) an averload on the output (even if it is
permanent), or an excessive ambient
temperature can be easily withstood.
2) the heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no device damage in the case of
excessive junction temperature : all that
happens is that Po (and therefore Ptot) and Io are
reduced.
The maximum allowable power dissipation de-
pends upon the size of the external heatsink (i.e.
its thermal resistance); Figure 18 shows this dissi-
pable power as a function of ambient temperature
for different thermal resistance.
Short circuit (AC Conditions). The TDA2009A can
withstand an accidentalshort circuit from the output
and ground made by a wrong connection during
normal play operation.
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