MAX8595XETA 데이터 시트보기 (PDF) - Maxim Integrated

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MAX8595XETA

High-Efficiency, 36V Step-Up Converters with TA Derating Option for 2 to 9 White LEDs

Maxim Integrated 

High-Efficiency, 36V Step-Up Converters

with TA Derating Option for 2 to 9 White LEDs

Typical Operating Characteristics (continued)

(Circuit of Figure 1, VIN = 3.6V, ILED = 25mA, L = 22µH, CIN = 2.2µF, COUT = 0.1µF, CCOMP = 0.1µF, RSENSE = 13Ω, 4 LEDs, TA = +25°C,

unless otherwise noted.)

VCTRL

IIN

ILED

VOUT

CTRL STEP RESPONSE

MAX8595X toc07

1V/div

0

100mA/div

0

20ms/div

40mA/div

0

10V/div

0

VCTRL

VIN

VOUT

ILED

DIRECT-PWM DIMMING RESPONSE

MAX8595X toc08

2V/div

32kHz 50%

DUTY CYCLE

0

20mV/div

AC-COUPLED

0

500mV/div

AC-COUPLED

0

10µs/div

10mA/div

0

Pin Description

PIN

NAME

FUNCTION

Overvoltage Sense. When VOUT is greater than 38V (typ), the internal n-channel MOSFET turns off

1

OUT

until VOUT drops below 36V (typ), then the IC reenters soft-start. Connect a 0.1µF ceramic capacitor

from OUT to ground. In shutdown, VOUT is one diode drop below VIN.

2

IN

Input Voltage Supply. The input voltage range is 2.6V to 6.0V. Connect a 2.2µF ceramic capacitor

from IN to GND.

Brightness Control Input. The voltage applied to CTRL controls LED brightness. Varying the voltage

3

CTRL

from 0.24V to 1.65V (1.72V for the MAX8596X) adjusts the brightness from dim to 100% brightness,

respectively. Any voltage above 1.65V (1.72V) does not increase brightness. Hold CTRL below

100mV to shut down the IC after an 8.2ms delay.

4

CS

Current-Sense Feedback Input. Connect a resistor from CS to GND to set the LED bias current. The

voltage at CS regulates to VCTRL / 5 or 0.330V (0.343V for the MAX8596X), whichever is lower.

Compensation Input. Connect a 0.1µF ceramic capacitor (CCOMP) from COMP to GND. CCOMP

5

COMP stabilizes the converter, controls soft-start, and lowpass filters direct PWM dimming at CTRL. CCOMP

discharges to 0V through an internal 20kΩ resistor in shutdown.

6

GND

Ground. Connect to PGND and the exposed pad directly under the IC.

7

PGND Power Ground. Connect to GND and the exposed pad directly under the IC.

8

LX

Inductor Connection. Connect LX to the node between the inductor and the Schottky diode. LX is

high impedance in shutdown.

—

EP

Exposed Pad. Connect to a large ground plane for maximum package heat dissipation. Connect

directly to GND and PGND under the IC.

_______________________________________________________________________________________ 5

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