MAX9944 데이터 시트보기 (PDF) - Maxim Integrated

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MAX9944

High-Voltage, Precision, Low-Power Op Amps

Maxim Integrated 

MAX9943/MAX9944

High-Voltage, Precision, Low-Power Op Amps

Absolute Maximum Ratings

Supply Voltage (VCC to VEE).................................-0.3V to +40V

All Other Pins (Note 1)................... (VEE - 0.3V) to (VCC + 0.3V)

OUT Short-Circuit Current Duration

8-Pin μMAX (VCC - VEE ≤ 20V)........................................... 3s

8-Pin μMAX (VCC - VEE > 20V)............................. Momentary

6-Pin TDFN (VCC - VEE ≤ 20V)......................................... .60s

6-Pin TDFN (VCC - VEE > 20V)........................................... 2s

8-Pin SO (VCC - VEE ≤ 20V).............................................. 60s

8-Pin SO (VCC - VEE > 20V)................................................ 2s

8-Pin TDFN (VCC - VEE ≤ 20V).......................................... 60s

8-Pin TDFN (VCC - VEE > 20V)........................................... 2s

Note 1: Operation is limited by thermal limits.

Continuous Input Current (Any Pins)................................±20mA

Thermal Limits (Note 2)

Multiple Layer PCB

Continuous Power Dissipation (TA = +70°C)

8-Pin μMAX (derate 4.8mW/°C above +70°C)..........387.8mW

6-Pin TDFN-EP (derate 23.8mW/°C above +70°C).... 1904.8mW

8-Pin SO (derate 7.6mW/°C above +70°C)..................606.1W

8-Pin TDFN-EP (derate 24.4mW/°C above +70°C).... 1951.2mW

Operating Temperature Range.......................... -40°C to +125°C

Junction Temperature.......................................................+150°C

Lead Temperature (soldering, 10s).................................. +300°C

Soldering Temperature (reflow)........................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 2)

8 μMAX

Junction-to-Ambient Thermal Resistance (θJA)......206.3°C/W

Junction-to-Ambient Case Resistance (θJC)................42°C/W

6 TDFN-EP

Junction-to-Ambient Thermal Resistance (θJA)...........42°C/W

Junction-to-Ambient Case Resistance (θJC)..................9°C/W

8 SO

Junction-to-Ambient Thermal Resistance (θJA).........132°C/W

Junction-to-Ambient Case Resistance (θJC)................38°C/W

8 TDFN-EP

Junction-to-Ambient Thermal Resistance (θJA)...........41°C/W

Junction-to-Ambient Case Resistance (θJC)..................8°C/W

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VCC = 15V, VEE = -15V, VCM = 0V, RL = 10kΩ to GND, VGND = 0V, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless

otherwise noted.) (Note 3)

PARAMETER

DC CHARACTERISTICS

Operating Supply Voltage Range

Quiescent Supply Current per

Amplifier

Power-Supply Rejection Ratio

Input Offset Voltage

Input Offset Voltage Drift

Input Bias Current

Input Offset Current

Input Voltage Range

Common-Mode Rejection Ratio

SYMBOL

CONDITIONS

VSUPPLY

ICC

PSRR

VOS

TCVOS

IBIAS

IOS

VIN+ , VIN-

CMRR

Guaranteed by PSRR test

VS = ±3V to ±19V

TA = +25°C

TA = -40°C to +125°C

VEE + 0.3V ≤ VCM ≤ VCC - 1.8V

VEE ≤ VCM ≤ VCC - 1.8V

VEE ≤ VCM ≤ VCC - 1.8V

Guaranteed by CMRR test,

TA = -40°C to +125°C

VEE + 0.3V ≤ VCM ≤ VCC - 1.8V

VEE ≤ VCM ≤ VCC - 1.8V

MIN TYP MAX UNITS

±3

±19

V

550

950

µA

105 130

dB

20

100

µV

240

0.4

µV/°C

4

20

nA

90

1

10

nA

VEE

VCC -

1.8

V

105 125

dB

105

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