MC10EP57(2000) 데이터 시트보기 (PDF) - ON Semiconductor
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MC10EP57 Datasheet PDF : 8 Pages
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0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
C
D
0.100 (0.004)
–T– SEATING
PLANE
MC10EP57
PACKAGE DIMENSIONS
TSSOP–20
DT SUFFIX
20 PIN PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
NOTES:
0.10 (0.004) M T U S V S
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
K
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
11
B
–U–
K1
ÍÍÍ J J1
ÍÍÍÍÍÍ SECTION N–N
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
10
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
N
0.25 (0.010)
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
A
M
MILLIMETERS
INCHES
–V–
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
N
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
F
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
DETAIL E
G
0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
–W–
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
GH
DETAIL E
L
6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
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