MC14175BDG 데이터 시트보기 (PDF) - ON Semiconductor
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MC14175BDG Datasheet PDF : 6 Pages
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MC14175B
PACKAGE DIMENSIONS
−A−
16
1
H
G
PDIP−16
CASE 648−08
ISSUE T
9
B
8
F
C
L
S
−T−
SEATING
PLANE
K
J
M
D 16 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M
0 _ 10 _ 0 _ 10 _
S 0.020 0.040 0.51 1.01
SOEIAJ−16
CASE 966−01
ISSUE A
16
1
Z
D
e
b
0.13 (0.005) M
9
E HE
8
LE
Q1
M_
L
DETAIL P
VIEW P
A
c
A1
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A
--- 2.05 --- 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e
1.27 BSC
0.050 BSC
HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M
0 _ 10 _ 0 _ 10 _
Q1 0.70 0.90 0.028 0.035
Z
--- 0.78 --- 0.031
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