NCV33274A(2013) 데이터 시트보기 (PDF) - ON Semiconductor
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NCV33274A
(Rev.:2013)
(Rev.:2013)
ON Semiconductor
NCV33274A Datasheet PDF : 20 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 1:1
D
14
PDIP−14
CASE 646−06
ISSUE S
A
8
E
H
E1
1
7
NOTE 8
b2
TOP VIEW
c
B
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
NOTE 3
L
A1
D1
SEATING
PLANE
C
M
e
14X b
eB
END VIEW
SIDE VIEW
0.010 M C A M B M
NOTE 6
STYLES ON PAGE 2
DATE 22 APR 2015
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
DIM MIN MAX
A −−−− 0.210
A1 0.015 −−−−
A2 0.115 0.195
b 0.014 0.022
b2 0.060 TYP
C 0.008 0.014
D 0.735 0.775
D1 0.005 −−−−
E 0.300 0.325
E1 0.240 0.280
e 0.100 BSC
eB −−−− 0.430
L 0.115 0.150
M −−−− 10 °
MILLIMETERS
MIN MAX
−−− 5.33
0.38 −−−
2.92 4.95
0.35 0.56
1.52 TYP
0.20 0.36
18.67 19.69
0.13 −−−
7.62 8.26
6.10 7.11
2.54 BSC
−−− 10.92
2.92 3.81
−−−
10 °
GENERIC
MARKING DIAGRAM*
14
XXXXXXXXXXXX
XXXXXXXXXXXX
AWLYYWWG
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASB42428B
DESCRIPTION: PDIP−14
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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