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NCV33274A(2013) 데이터 시트보기 (PDF) - ON Semiconductor

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NCV33274A Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
14
1
SCALE 2:1
0.15 (0.006) T U S
2X L/2 14
L
PIN 1
IDENT.
1
TSSOP14 WB
CASE 948G
ISSUE C
14X K REF
0.10 (0.004) M T U S V S
N
0.25 (0.010)
8
M
B
UN
F
7
DETAIL E
0.15 (0.006) T U S
A
V
K
J J1 ÇÇÉÉÇÇÉÉK1ÇÇÉÉ
SECTION NN
C
0.10 (0.004)
TSEATING
PLANE
D
G
H
DETAIL E
SOLDERING FOOTPRINT
7.06
1
14X
0.36
14X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
DATE 17 FEB 2016
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
W
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
GENERIC
MARKING DIAGRAM*
14
XXXX
XXXX
ALYWG
G
1
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= PbFree Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASH70246A
DESCRIPTION: TSSOP14 WB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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