MC74AC4040D 데이터 시트보기 (PDF) - ON Semiconductor
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MC74AC4040D Datasheet PDF : 6 Pages
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MC74AC4040
10
CLOCK
11
RESET
PIN 16 = VCC
PIN 8 = GND
9
Q1
7
Q2
6
Q3
5
Q4
3
Q5
2
Q6
4
Q7
13
Q8
12
Q9
14
Q10
15
Q11
1
Q12
Figure 2. Logic Diagram
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIN
VOUT
IIN
IOUT
ICC
PD
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC VCC or GND Current per Output Pin
Power Dissipation in Still Air
Plastic{
SOIC Package{
−0.5 to +7.0
V
−0.5 to VCC +0.5
V
−0.5 to VCC +0.5
V
±20
mA
±50
mA
±50
mA
mW
750
500
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 seconds
(Plastic DIP or SOIC Package)
−65 to +150
°C
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
†Derating: Plastic DIP: − 10mW/°C from 65°C to 125°C SOIC Package: −7.0 mW/°C from 65°C to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
VIN/VOUT
TA
DC Supply Voltage (Referenced to GND)
Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
tr/tf
Input Rise/Fall Time
VCC = 3.0 V
(Figure 1)
VCC = 4.5 V
VCC = 5.5 V
Min
Max
Unit
2.0
6.0
V
0
VCC
−
−40
+85
°C
0
150
ns/V
0
40
0
25
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