MC74LVX50 데이터 시트보기 (PDF) - ON Semiconductor
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MC74LVX50 Datasheet PDF : 10 Pages
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MC74LVX50
K
t TOP
COVER
TAPE
B1
K0
SEE
NOTE
11
FOR MACHINE REFERENCE
ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B0
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
P0
±0.2 mm
D
P2
(±0.008”)
E
A0 SEE NOTE 11
+ B0
+
+
FW
P
EMBOSSMENT
USER DIRECTION OF FEED
CENTER
LINES
OF CAVITY
D1
FOR COMPONENTS
2.0 mm × 1.2 mm
AND LARGER
R MIN.
BENDING RADIUS
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS “R”
WITHOUT DAMAGE
EMBOSSED
CARRIER
*TOP COVER
TAPE THICKNESS (t1)
0.10 mm
(0.004”) MAX.
EMBOSSMENT
MAXIMUM COMPONENT ROTATION
10°
TYPICAL
COMPONENT CAVITY
CENTER LINE
100 mm
(3.937”)
1 mm MAX
TAPE
TYPICAL
COMPONENT
CENTER LINE
1 mm
(0.039”) MAX
250 mm
(9.843”)
CAMBER (TOP VIEW)
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm
11. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
Figure 6. Carrier Tape Specifications
http://onsemi.com
6
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