MC74LVX50DTG(2014) 데이터 시트보기 (PDF) - ON Semiconductor

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MC74LVX50DTG
(Rev.:2014)

Hex Buffer

ON Semiconductor 

MC74LVX50

CAVITY TOP TAPE

TAPE

TAPE TRAILER

(Connected to Reel Hub)

NO COMPONENTS

160 mm MIN

COMPONENTS

DIRECTION OF FEED

Figure 9. Tape Ends for Finished Goods

TAPE LEADER

NO COMPONENTS

400 mm MIN

User Direction of Feed

Figure 10. TSSOP and SOIC R2 Reel Configuration/Orientation

TAPE UTILIZATION BY PACKAGE

Tape Size

8 mm

12 mm

16 mm

24 mm

SOIC

8−Lead

14−, 16−Lead

18−, 20−, 24−, 28−Lead

TSSOP

8−, 14−, 16−Lead

20−, 24−Lead

48−, 56−Lead

QFN

8−, 14−, 16−Lead

20−, 24−Lead

48−, 56−Lead

SC88A / SOT−353

SC88/SOT−363

5−, 6−Lead

ORDERING INFORMATION

Device

Package

Shipping†

MC74LVX50DG

SOIC−14 NB

(Pb−Free)

55 Units / Rail

MC74LVX50DR2G

SOIC−14 NB

(Pb−Free)

2500 Tape & Reel

MC74LVX50DTG

TSSOP−14

(Pb−Free)

96 Units / Rail

MC74LVX50DTR2G

TSSOP−14

(Pb−Free)

2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

http://onsemi.com

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