HI-5701/883 데이터 시트보기 (PDF) - Intersil
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HI-5701/883 Datasheet PDF : 8 Pages
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Die Characteristics
DIE DIMENSIONS:
2220µm x 3320µm x 19 ± 1mils
METALLIZATION:
Type: Si - Al
Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ± 1kÅ
DIE ATTACH:
Material: Gold Silicon Eutectic Alloy
Temperature: Ceramic DIP - 460oC (Max)
WORST CASE CURRENT DENSITY:
3.05 x 104 A/cm2
Metallization Mask Layout
HI-5701/883
HI-5701/883
VSS
CE2
CE1
1/2R
D2
D1
D0
VDD
Spec Number 512031
6-6
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