MCP1725 데이터 시트보기 (PDF) - Microchip Technology
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MCP1725 Datasheet PDF : 32 Pages
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MCP1725
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VOUT(MAX) + VDROPOUT(MAX) (Note 1), VR = 1.8V for Adjustable Output,
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
AC Performance
Output Delay From SHDN
TOR
—
100
—
µs SHDN = GND to VIN
VOUT = GND to 95% VR
Output Noise
eN
—
2.0
—
µV/√Hz IOUT = 200 mA, f = 1 kHz,
COUT = 10 µF (X7R Ceramic),
VOUT = 2.5V
Power Supply Ripple Rejection
Ratio
PSRR
—
60
—
dB f = 100 Hz, COUT = 10 µF,
IOUT = 10 mA,
VINAC = 30 mV pk-pk,
CIN = 0 µF
Thermal Shutdown Temperature
TSD
—
150
—
°C IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Thermal Shutdown Hysteresis
ΔTSD
—
10
—
°C IOUT = 100 µA, VOUT = 1.8V,
VIN = 2.8V
Note 1:
2:
3:
4:
The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX).
VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of VOUT = VR + VDROPOUT(MAX).
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above +150°C can impact device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 2.3V to 6.0V.
Parameters
Sym Min Typ Max Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
TJ
-40
— +125
°C Steady State
Maximum Junction Temperature
TJ
—
— +150
°C Transient
Storage Temperature Range
TA
-65
— +150
°C
Thermal Package Resistances
Thermal Resistance, 8LD 2x3 DFN
θJA
—
76
—
°C/W 4-Layer JC51-7
θJC
—
26
—
°C/W Standard Board with
vias
Thermal Resistance, 8LD SOIC
θJA
—
163
—
°C/W 4-Layer JC51-7
θJC
—
38.8
—
°C/W Standard Board
© 2007 Microchip Technology Inc.
DS22026B-page 7
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