MGA-52543 데이터 시트보기 (PDF) - HP => Agilent Technologies

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MGA-52543

Low Noise Amplifier

HP => Agilent Technologies 

1.00

0.039

1.30

0.051

0.60

0.024

2.00

0.079

.090

0.035

1.15

0.045

Dimensions in

inches

mm

Figure 3. Recommended PCB Pad Layout for

Agilent’s SC70 4L/SOT-343 Products.

This layout provides ample

allowance for package placement

by automated assembly equipment

without adding parasitics that

could impair the high frequency

RF performance of the MGA-

52543. The layout is shown with a

footprint of a SOT-343 package

superimposed on the PCB pads for

reference.

Starting with the package pad

layout in Figure 3, an RF layout

similar to the one shown in

Figure 4 is a good starting point

for microstripline designs using

the MGA-52543 amplifier.

42

RF

INPUT

Figure 4. RF Layout.

RF

OUTPUT

RF Grounding

Adequate grounding of pins 1 and

4 of the RFIC are important to

maintain device stability and RF

performance. Each of the ground

pins should be connected to the

groundplane on the backside of

the PCB by means of plated

through holes (vias). The ground

vias should be placed as close to

the package terminals as practical.

At least one via should be located

next to each ground pin to assure

good RF grounding. It is a good

practice to use multiple vias to

further minimize ground path

inductance.

PCB Materials

FR-4 or G-10 type materials are

good choices for most low cost

wireless applications using single

or multi-layer printed circuit

boards. Typical single-layer board

thickness is 0.020 to 0.031 inches.

Circuit boards thicker than 0.031

inches are not recommended due

to excessive inductance in the

ground vias.

For noise figure critical or higher

frequency applications, the

additional cost of PTFE/glass

dielectric materials may be

warranted to minimize transmis-

sion line loss at the amplifier’s

input.

Application Example

The printed circuit layout in

Figure 5 is a multi-purpose layout

that will accommodate compo-

nents for using the MGA-52543 for

RF inputs from 100 MHz through

6 GHz. This layout is a

microstripline design (solid

groundplane on the backside of

the circuit board) with 50 Ω

interfaces for the RF input and

output. The circuit is fabricated on

0.031-inch thick FR-4 dielectric

material. Plated through holes

(vias) are used to bring the ground

to the top side of the circuit where

needed. Multiple vias are used to

reduce the inductance of the paths

to ground.

Agilent

Technologies

MGA - 5X

IP 9/99

IN

OUT

Vd

Figure 5. Multi-purpose PCB Layout.

1.9 GHz Design

To illustrate the simplicity of using

the MGA-52543, a 1.9 GHz ampli-

fier for PCS type receiver applica-

tions is presented.

For low noise amplifier applica-

tions, the MGA-52543 is internally

matched for low noise figure. The

magnitude of Γopt at 1900 MHz is

typically 0.27, additional imped-

ance matching may improve noise

figure by 0.1 dB.

Without external matching the

typical input return loss for the

MGA-52543 is approximately 5 dB.

The input return loss may be

improved significantly with the

addition of a series inductor. At

1900 MHz for example, the

addition of a series inductor of

3.3 nH will improve the input

return loss to greater than 10 dB.

The output of the MGA-52543 is

already well matched to 50Ω and

no additional matching is needed.

However, using another series

inductor on the output of the

MGA-52543 significantly improves

the output match, gain and the IP3

performance of the device.

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