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MJF122 데이터 시트보기 (PDF) - ON Semiconductor

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MJF122
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MJF122 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
NPN
MJF122
COLLECTOR
MJF122, MJF127
PNP
MJF127
COLLECTOR
BASE
8 k 120
EMITTER
BASE
8 k 120
Figure 13. Darlington Schematic
EMITTER
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
CLIP
PACKAGE
LEADS
MOUNTED
FULLY ISOLATED
CLIP
PACKAGE
0.099" MIN
LEADS
MOUNTED
FULLY ISOLATED
PACKAGE
0.099" MIN
LEADS
HEATSINK
0.110" MIN
HEATSINK
HEATSINK
Figure 14. Clip Mounting Position
for Isolation Test Number 1
Figure 15. Clip Mounting Position
for Isolation Test Number 2
*Measurement made between leads and heatsink with all leads shorted together
Figure 16. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION
4−40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 17. Typical Mounting Techniques*
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a
constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess of 20 in . lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the pack-
age. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend
exceeding 10 in . lbs of mounting torque under any mounting conditions.
** For more information about mounting power semiconductors see Application Note AN1040.
http://onsemi.com
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