MLG0603Q2N2B 데이터 시트보기 (PDF) - TDK Corporation
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MLG0603Q2N2B Datasheet PDF : 6 Pages
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SMD Inductors(Coils)
For High Frequency(Multilayer)
Conformity to RoHS Directive
MLG Series MLG0603Q Type
FEATURES
• It serializes a product of acquisition inductance 0.3 to15nH. In a
product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.
• By the most suitable design, Q is higher than competing in a
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
0.06±0.04
PRODUCT IDENTIFICATION
MLG 0603 Q 2N2 S T
(1) (2) (3) (4) (5) (6)
(1) Multilayer ceramic chip coil
(2) Dimensions
0603
(3) Series name
(4) Inductance value
2N2
12N
(5) Inductance tolerance
B
C
S
H
J
(6) Packaging style
T
0.6× 0.3mm (L× W)
2.2nH
12nH
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
Taping (reel)
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
0.15±0.05
Weight: 0.2mg
Dimensions in mm
RECOMMENDED PC BOARD PATTERN
0.2 to 0.3 0.25 to 0.35 0.2 to 0.3
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
10s max.
Natural
cooling
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
003-01 / 20070703 / e521_mlg0603q.fm
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