DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

MPC9443 데이터 시트보기 (PDF) - Motorola => Freescale

부품명
상세내역
제조사
MPC9443
Motorola
Motorola => Freescale Motorola
MPC9443 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Freescale Semiconductor, Inc.
MPC9443
Power Consumption of the MPC9443 and Thermal
Management
The MPC9443 AC specification is guaranteed for the
entire operating frequency range up to 350 MHz. The
MPC9443 power consumption and the associated long-term
reliability may decrease the maximum frequency limit,
depending on operating conditions such as clock frequency,
supply voltage, output loading, ambient temperture, vertical
convection and thermal conductivity of package and board.
This section describes the impact of these parameters on the
junction temperature and gives a guideline to estimate the
MPC9443 die junction temperature and the associated
device reliability. For a complete analysis of power
consumption as a function of operating conditions and
associated long term device reliability please refer to the
application note AN1545. According the AN1545, the
long-term device reliability is a function of the die junction
temperature:
Table 13: Die junction temperature and MTBF
Junction temperature (°C)
MTBF (Years)
100
20.4
In equation 2, P stands for the number of outputs with a
parallel or thevenin termination, VOL, IOL, VOH and IOH are a
function of the output termination technique and DCQ is the
clock signal duty cyle. If transmission lines are used ΣCL is
zero in equation 2 and can be eliminated. In general, the use
of controlled transmission line techniques eliminates the
impact of the lumped capacitive loads at the end lines and
greatly reduces the power dissipation of the device. Equation
3 describes the die junction temperature TJ as a function of
the power consumption.
Where Rthja is the thermal impedance of the package
(junction to ambient) and TA is the ambient temperature.
According to Table 13, the junction temperature can be used
to estimate the long-term device reliability. Further, combining
equation 1 and equation 2 results in a maximum operating
frequency for the MPC9443 in a series terminated
transmission line system.
TJ,MAX should be selected according to the MTBF system
requirements and Table 13. Rthja can be derived from Table
14. The Rthja represent data based on 1S2P boards, using
2S2P boards will result in a lower thermal impedance than
indicated below.
110
9.1
Table 14: Thermal package impedance of the 48ld LQFP
120
4.2
Convection, LFPM
Rthja (1P2S
Rthja (2P2S
130
2.0
board), K/W
board), K/W
Increased power consumption will increase the die
Still air
69
53
junction temperature and impact the device reliability
100 lfpm
(MTBF). According to the system-defined tolerable MTBF, the
200 lfpm
64
50
die junction temperature of the MPC9443 needs to be
controlled and the thermal impedance of the board/package
should be optimized. The power dissipated in the MPC9443
300 lfpm
400 lfpm
is represented in equation 1.
500 lfpm
Where ICCQ is the static current consumption of the
If the calculated maximum frequency is below 250 MHz, it
MPC9443, CPD is the power dissipation capacitance per
becomes the upper clock speed limit for the given application
output, (Μ)ΣCL represents the external capacitive output
conditions. The following eight derating charts describe the
load, N is the number of active outputs (N is always 16 in case
safe frequency operation range for the MPC9443. The charts
of the MPC9443). The MPC9443 supports driving
were calculated for a maximum tolerable die junction
transmission lines to maintain high signal integrity and tight
temperature of 110°C (120°C), corresponding to an
timing parameters. Any transmission line will hide the lumped
estimated MTBF of 9.1 years (4 years), a supply voltage of
capacitive load at the end of the board trace, therefore, ΣCL is
3.3V and series terminated transmission line or capacitive
zero for controlled transmission line systems and can be
loading. Depending on a given set of these operating
eliminated from equation 1. Using parallel termination output
termination results in equation 2 for power dissipation.
conditions and the available device convection a decision on
the maximum operating frequency can be made.
+ƪ ) @ @ǒ @ )ȍ Ǔƫ@ PTOT
ICCQ VCC fCLOCK
N CPD
CL
M
VCC
Equation 1
+ @ƪ ) @ @ǒ @ )ȍ Ǔƫ)ȍƪ @ @ǒ * Ǔ)ǒ * Ǔ@ @ ƫ PTOT VCC
ICCQ VCC fCLOCK
N CPD
CL
DCQ IOH VCC VOH 1 DCQ IOL VOL Equation 2
M
P
+ ) @ TJ TA PTOT Rthja
+ @ @ @ ƪ * * ǒ @ Ǔƫ fCLOCK,MAX
1
CPD N V2CC
TJ,MAX TA
Rthja
ICCQ VCC
Equation 3
Equation 4
TIMING SOLUTIONS
For More Informa9tion On This Product,
Go to: www.freescale.com
MOTOROLA

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]