PACKAGE DIMENSIONS
C
B
J
S
M
-A-
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE
ANSI Y14.5M, 1982.
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
PIN 1
SEATING
PLANE
-T-
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M
30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
BASIC ELEMENT (D)
CASE 867-08
ISSUE N
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2
VACUUM
(P2)
SEATING
PLANE
-T-
P
0.25 (0.010) M T Q M
X
R
N
B
C
-T-
SEATING
PLANE
J
PIN 1
-A-
U
WL
V
1 2 34 5 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
-Q-
K
S
INCHES
DIM MIN MAX
A 1.145 1.175
B 0.685 0.715
C 0.405 0.435
D 0.027 0.033
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
K 0.695 0.725
L 0.290 0.300
N 0.420 0.440
P 0.153 0.159
Q 0.153 0.159
R 0.063 0.083
S 0.220 0.240
U 0.910 BSC
V 0.182 0.194
W 0.310 0.330
X 0.248 0.278
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
0.68 0.84
1.22 1.63
2.54 BSC
0.36 0.41
17.65 18.42
7.37 7.62
10.67 11.18
3.89 4.04
3.89 4.04
1.60 2.11
5.59 6.10
23.11 BSC
4.62 4.93
7.87 8.38
6.30 7.06
G
F
D 6 PL
0.13 (0.005) M A M
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
PRESSURE AND VACUUM SIDE DUAL PORTED (DP)
CASE 867C-05
ISSUE F
MPX4250D
6
Sensors
Freescale Semiconductor