MPX12 데이터 시트보기 (PDF) - Freescale Semiconductor

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MPX12

10 kPa Uncompensated Silicon Pressure Sensors

Freescale Semiconductor 

Gel Die Coat

Wire Bond

Lead Frame

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Pressure

P2

Differential Sensing

Element

Die Bond

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential/gauge die. A gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

Operating characteristics, internal reliability and

qualification tests are based on use of dry clean air as the

pressure media. Media other than dry clean air may have

adverse effects on sensor performance and long term

reliability. Contact the factory for information regarding media

compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing gel which isolates

the die from the environment. The Freescale MPVZ12 series

is designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table

Part Number

MPXV12GW6U

MPXV12GW7U

MPX12D

MPX12DP

Case Type

1735

1560

344

344C

MPX12GP

344B

Pressure (P1) Side

Identifier

Side with Port

Side with Port

Stainless Steel Cap

Side with Part Marking

Side with Port Attached

Sensors

Freescale Semiconductor

MPX12

5

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