MPX5010DP 데이터 시트보기 (PDF) - Motorola => Freescale
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MPX5010DP
Motorola => Freescale
MPX5010DP Datasheet PDF : 10 Pages
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MPX5010 SERIES
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5010 series pressure sensor operating character-
istics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information
regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
SILICONE
DIE
STAINLESS STEEL
DIE COAT
METAL COVER
WIRE
LEAD
FBROANMDEÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉPÉÉÉÉ1 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉRBTOVNDDIE
P2
EPOXY CASE
Figure 2. Cross–Sectional Diagram
(Not to Scale)
MPX5010
OUTPUT
(PIN 1)
50 pF
A/D
51 k
µ PROCESSOR
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
5.0
TRANSFER FUNCTION:
4.5 Vout = VS*(0.09*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
TEMP = 0 to 85°C
3.5
3.0
2.5
2.0
1.5 MAX
TYPICAL
1.0
MIN
0.5
0
0 1 2 3 4 5 6 7 8 9 10 11
DIFFERENTIAL PRESSURE (kPa)
Figure 4. Output versus Pressure Differential
Motorola Sensor Device Data
3
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