MPX53 데이터 시트보기 (PDF) - Freescale Semiconductor
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MPX53 Datasheet PDF : 9 Pages
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Wire Bond
Silicone
Die Coat
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
RTV Die
Bond
P2
Figure 4. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 4 illustrates the differential or gauge configuration
in the unibody chip carrier (Case 344). A silicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX53/MPXV53GC series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number
MPX53D
MPX53DP
MPX53GP
MPX53GC Series
Case Type
Pressure (P1) Side
Identifier
344
Stainless Steep Cap
344C Side with Port Marking
344B Side with Port Attached
482A, 482C Side with Port Attached
Sensors
Freescale Semiconductor
MPX53
5
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