MT90880/1/2/3
Data Sheet
2.0 Physical Specification
The device is contained in a 456-ball plastic ball grid array (456 PBGA) package:
• Body Size: 27 mm x 27 mm
• Ball Count: 456
• Ball Pitch: 1.0 mm
• Ball Matrix: 26 x 26 (partially populated with a 6 x 6 GND matrix in the centre)
• Ball Diameter 0.63 mm
• Total Package Thickness 2.03 mm
Package is viewed from the top side (e.g,. through top of the package). Note ball A1 is non-chamfered corner.
Figure 2 - Package View and Ball Positions
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Zarlink Semiconductor Inc.