NCP4588
VIN
VOUT
VIN
Vref
Vref
Current Limit
CE
CE
GND
Current Limit
NCP4588Hxxxxxxx
NCP4588Dxxxxxxx
Figure 2. Simplified Schematic Block Diagram
VOUT
GND
PIN FUNCTION DESCRIPTION
Pin No.
XDFN
Pin No.
SC−70
Pin No.
SOT23
4
5
1
2
3
2
3
1
3
6
4
5
1, 5
2
4
Pin Name
VIN
GND
CE
VOUT
NC
Description
Input pin
Ground
Chip enable pin (Active “H”)
Output pin
No connection
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
Output Voltage
VIN
6.0
V
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
−0.3 to 6.0
V
Output Current
Power Dissipation XDFN
Power Dissipation SC70
IOUT
PD
400
mA
400
mW
380
Power Dissipation SOT23
420
Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
TSTG
−55 to 125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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