NCP4681(2011) 데이터 시트보기 (PDF) - ON Semiconductor
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NCP4681 Datasheet PDF : 18 Pages
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NCP4681, NCP4684
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
Output Voltage
Chip Enable Input
Output Current
Power Dissipation XDFN0808
Power Dissipation SC−70
VIN
6.0
V
VOUT
−0.3 to VIN + 0.3
V
VCE
6.0
V
IOUT
180
mA
PD
286
mW
380
Power Dissipation SOT23
420
Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
TSTG
−55 to 125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, XDFN 0.8 x 0.8 mm
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SOT23
Thermal Resistance, Junction−to−Air
Thermal Characteristics, SC−70
Thermal Resistance, Junction−to−Air
Symbol
RqJA
RqJA
RqJA
Value
350
238
263
Unit
°C/W
°C/W
°C/W
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