NCV4299 데이터 시트보기 (PDF) - ON Semiconductor
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NCV4299 Datasheet PDF : 23 Pages
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NCV4299
MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage to Regulator (DC)
Input Peak Transient Voltage to Regulator wrt GND
Inhibit (INH) (Note 1)
Sense Input (SI)
Sense Input (SI)
Reset Threshold (RADJ)
Reset Threshold (RADJ)
Reset Delay (D)
Reset Output (RO)
Sense Output (SO)
Output (Q)
Output (Q)
ESD Capability, Human Body Model (Note 5)
ESD Capability, Machine Model (Note 5)
ESD Capability, Charged Device Model (Note 5)
Junction Temperature
Storage Temperature
VI
−
VINH
VSI
ISI
VRE
IRE
VD
VRO
VSO
VQ
IQ
ESDHB
ESDMM
ESDCDM
TJ
Tstg
−40
−
−40
−0.3
−1.0
−0.3
−10
−0.3
−0.3
−0.3
−0.3
−5.0
2.0
200
1.0
−
−50
45
V
60
V
45
V
45
V
1.0
mA
7.0
V
10
mA
7.0
V
7.0
V
7.0
V
16
V
−
mA
−
kV
−
V
−
kV
150
°C
150
°C
OPERATING RANGE
Input Voltage
5.0 V Version
3.3 V Version
Junction Temperature
VI
4.5
4.4
TJ
−40
V
45
45
150
°C
LEAD TEMPERATURE SOLDERING REFLOW (Note 3)
Lead Temperature Soldering (Note 5)
Reflow (SMD styles only), leaded
60−150 sec above 183, 30 sec max at peak
TSLD
°C
−
240 Pk
Reflow (SMD styles only), lead free
60s−150 sec above 217, 40 sec max at peak
TSLD
°C
−
265 Pk
Moisture Sensitivity Level
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 14 pin package only.
2. Preliminary numbers.
3. Per IPC / JEDEC J−STD−020C.
4. Measured to Pin 4. All ground pins connected to ground.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model.
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