SA556-1F 데이터 시트보기 (PDF) - Philips Electronics
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SA556-1F Datasheet PDF : 5 Pages
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Philips Semiconductors Linear Products
Dual timer
Product specification
NE/SA/SE556/NE556-1
EQUIVALENT SCHEMATIC (Shown for one circuit only)
VCC
R1
R2
R3 R4
R7
4.7K
330
4.7K 1K
5K
CONTROL VOLTAGE
R12
6.8K
Q5
Q6 Q7
Q9
Q8
THRESHOLD
Q1
Q4
Q2 Q3
TRIGGER
RESET
DISCHARGE
GND
Q25
Q14
R5
10K
Q11 Q12
Q10
Q13
R6
100K
R16
100
Q21
Q19
Q22
R13
3.3K
CB
Q18
R8 E
5K
R10
3.2
K
R11
4.7K
Q23
CB
Q20
Q17
R14
220
Q16
Q15
R9
R15
5K
4.7K
OUTPUT
Q24
ORDERING INFORMATION
DESCRIPTION
14-Pin Plastic Small Outline (SO) Package
14-Pin Ceramic Dual In-Line Package (CERDIP)
14-Pin Plastic Dual In-Line Package (DIP)
14-Pin Ceramic Dual In-Line Package (CERDIP)
14-Pin Plastic Dual In-Line Package (DIP)
14-Pin Plastic Dual In-Line Package (DIP)
14-Pin Ceramic Dual In-Line Package (CERDIP)
14-Pin Plastic Dual In-Line Package (DIP)
TEMPERATURE RANGE
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
0 to +70°C
-40°C to +85°C
-55°C to +125°C
-55°C to +125°C
ORDER CODE
NE556D
NE556F
NE556N
NE556-1F
NE556-1N
SA556N
SE556F
SE556N
DWG #
0175D
0581B
0405B
0581B
0405B
0405B
0581B
0405B
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
NE/SA556, NE556-1
+16
V
SE556
+18
V
PD
Maximum allowable power dissipation1
800
mW
TA
Operating temperature range
NE556-1, NE556
0 to +70
°C
SA556
-40 to +85
°C
SE556
-55 to +125
°C
TSTG
TSOLD
Storage temperature range
Lead soldering temperature (10sec max)
-65 to +150
°C
+300
°C
NOTES:
1. The junction temperature must be kept below 125°C for the D package and below 150°C for the N and F packages. At ambient temperatures
above 25°C, where this limit would be exceeded, the Maximum Allowable Power Dissipation must be derated by the following:
D package 115°C/W
N package 80°C/W
F package 100°C/W
August 31, 1994
354
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