NLX2G04 데이터 시트보기 (PDF) - ON Semiconductor

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NLX2G04

Dual Inverter

ON Semiconductor 

NLX2G04

PACKAGE DIMENSIONS

UDFN6, 1.2x1.0, 0.4P

CASE 517AA

ISSUE D

D

PIN ONE

REFERENCE

2X

0.10 C

ÉÉÉÉ

TOP VIEW

2X

0.10 C

0.10 C

10X

0.08 C

SIDE VIEW

A

B

E

(A3)

A

EDGE OF PACKAGE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

L1

AND IS MEASURED BETWEEN 0.25 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

DETAIL A

PAD AS WELL AS THE TERMINALS.

Bottom View

MILLIMETERS

(Optional)

DIM MIN MAX

A 0.45 0.55

EXPOSED Cu

MOLD CMPD

A1 0.00 0.05

A3 0.127 REF

ÉÉÉÉÉÉ

A1

DETAIL B

b 0.15 0.25

D 1.20 BSC

A3

E 1.00 BSC

e 0.40 BSC

L 0.30 0.40

L1 0.00 0.15

L2 0.40 0.50

Side View

(Optional) MOUNTING FOOTPRINT*

SEATING

PLANE

A1

C

6X

0.42

6X

0.22

5X L

1

3

L2

6X b

6

0.10 C A B

0.05 C NOTE 3

4

e

BOTTOM VIEW

0.40

PITCH

1.07

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

6

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