NLX2G04 데이터 시트보기 (PDF) - ON Semiconductor

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NLX2G04

Dual Inverter

ON Semiconductor 

NLX2G04

PACKAGE DIMENSIONS

UDFN6 1.0x1.0, 0.35P

CASE 517BX

ISSUE O

D

AB

PIN ONE

REFERENCE

ÉÉÉÉÉÉÉÉÉ 2X

0.10 C

E

2X

0.10 C TOP VIEW

0.05 C

A3

A

0.05 C

A1

SIDE VIEW

C

SEATING

PLANE

e

1

L1

5X L

3

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b 0.12 0.22

D 1.00 BSC

E 1.00 BSC

e

0.35 BSC

L 0.25 0.35

L1 0.30 0.40

RECOMMENDED

SOLDERING FOOTPRINT*

5X

0.48

6X

0.22

1.18

6

4

BOTTOM VIEW

6X b

0.10 M

0.05 M

CAB

C NOTE 3

1

0.53

PKG

OUTLINE

0.35

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

8

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