NVD0.4ZJJ 데이터 시트보기 (PDF) - Power-One Inc.
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NVD0.4ZJJ Datasheet PDF : 11 Pages
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NV DC-DC Series Data Sheet
6W SMT Converter • Wide Input • 3.3V to +/-24V Outputs
Surface Mount Assembly
Soldering:
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-One
will not honor any warranty claims arising from failure
to observe these instructions.
This product is approved for forced convection reflow
soldering only.
The curves below define the maximum peak reflow
temperature permissible measured on Pins 1 and 13
of the converter.
The lead-frame is constructed from a high
temperature glass filled, UL94V0 flame retardant,
diallyl ortho-phthalate moulding compound
commonly used for packaging of electronics
components. It passes NASA outgassing tests and
is certified to MIL-M-14. The coefficient of thermal
expansion is equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore
they facilitate optical inspection (manual or
automatic). The leads are formed from a 97% Cu
alloy plated with Cu and Sn 90. This material is
commonly used in the manufacture of integrated
circuits. It has good corrosion resistance and
exhibits the nobility inherent to all high copper
alloys. Unlike brasses, this material is essentially
immune to stress corrosion cracking. It also exhibits
excellent solderability. It is readily wetted by solders
and performs well in standard solderability tests.
(Dip of Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’. This
ensures that there is no contamination or
mechanical stress on the lead-frame so that the co-
planarity and solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application (co-
planarity within 0.1 mm).
Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
300
Peak Temperature
(See fig below)
250
200
150
tp
100
50
0
190 – 450 s
Time (s)
Restriction curve above 215ºC
Peak temp. at pins 1 and 10 (ºC)
245
240
235
230
225
220
215
210
205
200
10 20 30 40 50 60
tp (s)
Pick & Place Assembly:
The product is designed with a large flat area in the
center of the top surface to serve as a pick up point
for automated vacuum pick and place equipment.
The ‘open board’ construction of the unit ensures
that weight is kept to a minimum. However due to the
relatively large size of the component, a large nozzle
(> 6.0mm, depending on vacuum pressure) is
recommended for picking and placing.
The unit may also be automatically handled using
‘odd-form’ placement equipment, with mechanical
grippers. For this type of equipment the end edges
of the device, which have no leads and also feature
the greatest dimensional accuracy, should be used
as pick-up points.
APR 20, 2006 revised to MAR 12, 2007
Page 8 of 11
www.power-one.com
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