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AM29LV800BT90RDW5C1 데이터 시트보기 (PDF) - Advanced Micro Devices

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AM29LV800BT90RDW5C1 Datasheet PDF : 9 Pages
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SUPPLEMENT
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
Am29LV800B T -90 DP
5
C
1
DIE REVISION
This number refers to the specific AMD manufacturing
process and product technology reflected in this document.
It is entered in the revision field of AMD standard product
nomenclature.
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
DIE THICKNESS
5 = 500 µm
PACKAGE TYPE AND MINIMUM ORDER QUANTITY*
DP = Waffle Pack
Die per 5 tray stack
DG = Gel-Pak® Die Tray
Die per 6 tray stack
DT =
DW =
Surftape™ (Tape and Reel)
Die per 7-inch reel
Gel-Pak® Wafer Tray (sawn wafer on frame)
Call AMD sales office for minimum order quantity
* Contact an AMD representative for quantities.
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29LV800B Known Good Die
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory—Die Revision 1
3.0 Volt-only Program and Erase
Valid Combinations
Am29LV800BT-90
Am29LV800BB-90
Am29LV800BT-120
Am29LV800BB-120
DPC 1, DPI 1,
DGC 1, DGI 1,
DTC 1, DTI 1,
DWC 1, DWI 1
Valid Combinations
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
6
Am29LV800B Known Good Die

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