CXD1175AP 데이터 시트보기 (PDF) - Sony Semiconductor

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CXD1175AP

8-bit 20MSPS Video A/D Converter (CMOS)

Sony Semiconductor 

Package Outline

Unit: mm

CXD1175AM

24PIN SOP (PLASTIC)

+ 0.4

15.0 – 0.1

24

13

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

12

1.27

+ 0.1

0.2 – 0.05

± 0.12 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-24P-L01

∗SOP024-P-0300-A

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY/PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY / 42ALLOY

PACKAGE WEIGHT

0.3g

CXD1175AP

24

24PIN DIP(PLASTIC)

+ 0.4

30.2 – 0.1

13

1

12

2.54

0° to 15°

CXD1175AM/AP

0.5 ± 0.1

1.2 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-24P-01

DIP024-P-0400

Two kinds of package surface:

1.All mat surface type.

2.All mirror surface type.

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42/COPPER ALLOY

PACKAGE MASS

2.0g

– 20 –

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