NXP Semiconductors
PCF8564A
Real time clock and calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
Description
PCF8564AU/5BB/1 PCF8564AU wire bond die; 9 bonding pads
PCF8564AU/5GB/1 PCF8564AU wire bond die; 9 bonding pads
PCF8564AU/5GC/1 PCF8564AU wire bond die; 9 bonding pads
PCF8564AU/10AB/1 PCF8564AU wire bond die; 9 bonding pads
PCF8564ACX9/1
PCF8564ACX9 wafer level chip-size package;
9 bumps; 1.27 × 1.9 × 0.29 mm
PCF8564ACX9/B/1
PCF8564ACX9 wafer level chip-size package;
9 bumps; 1.27 × 1.9 × 0.29 mm
5. Marking
Delivery form
unsawn wafer
unsawn wafer
unsawn wafer
wafer sawn on FFC
wafer sawn on FFC;
die with solder bumps
tape and reel;
die with solder bumps
Version
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564ACX9
PCF8564ACX9
Table 2. Marking codes
Type number
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/5GC/1
PCF8564AU/10AB/1
PCF8564ACX9/1
PCF8564ACX9/B/1
Marking code
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PCF8564A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 30 September 2010
© NXP B.V. 2010. All rights reserved.
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