PCK953BD/G 데이터 시트보기 (PDF) - NXP Semiconductors.
부품명
상세내역
제조사
PCK953BD/G Datasheet PDF : 15 Pages
| |||
NXP Semiconductors
PCK953
20 MHz to 125 MHz PECL input, 9 CMOS output, 3.3 V PLL clock driver
13. Packing information
Table 8. Packing information
Type number
Ordering code
(12NC)
PCK953BD
9352 679 41118
PCK953BD
9352 679 41128
PCK953BD
9352 679 41151
PCK953BD
9352 679 41157
PCK953BD/G 9352 761 22128
Package
SOT358-1
(LQFP32)
SOT358-1
(LQFP32)
SOT358-1
(LQFP32)
SOT358-1
(LQFP32)
SOT358-1
(LQFP32)
Packing
Description
reel pack, SMD, 13”
reel pack, SMD, 13”, turned
tray pack, bakeable, single
180° rotation package orientation
in reel
JEDEC standard package orientation
in reel
tray pack, bakeable, multiple
reel pack, SMD, 13”, turned JEDEC standard package orientation
in reel
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
PCK953_5
Product data sheet
• Board specifications, including the board finish, solder masks and vias
Rev. 05 — 9 October 2008
© NXP B.V. 2008. All rights reserved.
10 of 15
Share Link: 