NXP Semiconductors
NPN/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = open
Product data sheet
PEMD4; PUMD4
ORDERING INFORMATION
TYPE NUMBER
PEMD4
−
PUMD4
−
NAME
PACKAGE
DESCRIPTION
plastic surface mounted package; 6 leads
plastic surface mounted package; 6 leads
VERSION
SOT666
SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
Per transistor; for the PNP transistor with negative polarity
VCBO
VCEO
VEBO
IO
ICM
Ptot
Tstg
Tj
Tamb
Per device
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current (DC)
peak collector current
total power dissipation
SOT363
SOT666
storage temperature
junction temperature
operating ambient temperature
open emitter
open base
open collector
Tamb ≤ 25 °C
note 1
notes 1 and 2
Ptot
total power dissipation
SOT363
SOT666
Tamb ≤ 25 °C
note 1
notes 1 and 2
MIN.
−
−
−
−
−
−
−
−65
−
−65
−
−
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
MAX.
50
50
5
100
100
200
200
+150
150
+150
300
300
UNIT
V
V
V
mA
mA
mW
mW
°C
°C
°C
mW
mW
2003 Oct 10
3