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HI5675 데이터 시트보기 (PDF) - Intersil

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HI5675 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
123
L
SEATING PLANE
D
A
e
B
0.24 M
µα
A1
C
0.15(0.006)
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs.
2. Dimension “E” does not include interlead flash or protrusions.
3. “L” is the length of terminal for soldering to a substrate.
4. “N” is the number of terminal positions.
5. Terminal numbers are shown for reference only.
6. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M24.2-S
24 LEAD SMALL OUTLINE PLASTIC PACKAGE (200 MIL)
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.067 0.088 1.70
2.25
-
A1
0.002 0.011 0.05
0.30
-
B
0.014 0.021 0.35
0.55
-
C
0.006 0.011 0.15
0.30
-
D
0.587 0.606 14.9
15.4
1
E
0.205 0.220 5.2
5.6
2
e
0.050 BSC
1.27 BSC
-
H
0.296 0.326 7.5
8.3
-
L
0.012 0.027 0.30
0.70
3
N
24
24
4
α
0o
10o
0o
10o
-
Rev. 1 4/95
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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