PS2705-1
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 ˚C
• Number of reflows
• Flux
235 ˚C (package surface temperature)
30 seconds or less
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is
recommended).
Recommended Temperature Profile of Infrared Reflow
120 to 160 ˚C
60 to 90 s
(preheating)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
210 ˚C
Time (s)
Peak temperature 235˚ C or below
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
260 ˚C or below (molten solder temperature)
10 seconds or less
One
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is recommended).
CAUTION
This device contains GaAs (Gallium Arsenide) material which is a harmful substance if ingested.
Please do not under any circumstances break the hermetic seal.
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
01/17/2001